3D Wafer-on-Wafer (WoW) IC Design Services
Syntronix offers advanced 3D Wafer-on-Wafer (WoW) IC design services to help customers build high-performance, space-efficient chips. We were the first to integrate the ARM Ethos-U65 NPU with Cortex-M55, using state-of-the-art 3D DRAM wafer stacking.
Our WoW technology stacks CPU and DRAM at the wafer level, boosting speed, reducing latency, and saving space—perfect for Edge AI and next-gen SoC designs.
Low Latency
Reduces signal delay between logic circuits and memory
High Performance
Enables ultra-high bandwidth for rapid data transfer
Small size
Through-Silicon Via (TSV) Technology
Flexible Design
Can be combined with ARM or RISC-V core
Heterogeneous Integration
Seamlessly integrates logic and memory for enhanced efficiency
Advanced Development
Leading the way in 3D stacking technology
Reliable Team Background
Syntronix has a highly experienced 3D IC design team, bringing together experts in semiconductors, packaging, and system architecture.
Our engineering team excels in EDA design tools, chip verification, and advanced packaging technologies. By working closely with leading foundries and packaging partners, we ensure every design meets the highest industry standards, delivering innovative and high-performance chip solutions.
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